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IEC标准列表：
151IEC标准电压 > IEC 60038 AMD 2-1997 IEC标准电压.第2次修订 IEC standard voltages; Amendment 2

152IEC标准电压 > IEC 60038 AMD 1-1994 IEC标准电压.修改件1 IEC standard voltages; Amendment 1

153IEC 60500-1974 IEC标准水听器 IEC standard hydrophone

154IEC 60541-1976 IEC与北美软线类型对比资料 Comparative information on I E C and North American flexible cord types

155IEC 61346-1-1996 Industrial systems, installations and equipment and industrial products - Structuring principles and reference designations - Part 1: Basic rules . Industrial systems, installations and equipment and industrial products - Structuring principles and reference designations - Part 1: Basic rules .

156IEC 60050-821-1998 International Electrotechnical Vocabulary - Part 821: Signalling and security apparatus for railways . International Electrotechnical Vocabulary - Part 821: Signalling and security apparatus for railways .

157IEC 62360-2004 ISDB(数字广播综合服务)用卫星和地面接收机的基础规范 Baseline specifications of satellite and terrestrial receivers for ISDB (Integrated Service for Digital Broadcast

158IEC 60254-2 Edition 3.1-2000 Lead-acid traction batteries - Part 2: Dimensions of cells and terminals and marking of polarity on cells . Lead-acid traction batteries - Part 2: Dimensions of cells and terminals and marking of polarity on cells .

159IEC 61747-4-1-2004 Liquid crystal display devices - Part 4-1: Matrix colour LCD modules - Essential ratings and characteristics . Liquid crystal display devices - Part 4-1: Matrix colour LCD modules - Essential ratings and characteristics .

160(MAgnetic mAteriAls - PArt 4: Methods of meAsurement of d.c. mAgnetic properties of mAgneticAlly soft mAteriAls) > IEC 60404-4 Edition 2.1-2000 Magnetic materials - Part 4: Methods of measurement of d.c. magnetic properties of magnetically soft materials . Magnetic materials - Part 4: Methods of measurement of d.c. magnetic properties of magnetically soft materials .

161IEC 61249-2-1-2005 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

162IEC 61249-2-2-2005 Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad .

163IEC 61249-2-22-2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined fl Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad .

164IEC 61249-2-23-2005 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, econom Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad .

165IEC 61249-2-26-2005 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets o Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper

166IEC 61094-6-2004 Measurement microphones - Part 6: Electrostatic actuators for determination of frequency response . Measurement microphones - Part 6: Electrostatic actuators for determination of frequency response .

167IEC 60601-1-SER-2004 Medical electrical equipment - ALL PARTS . Medical electrical equipment - ALL PARTS .

168IEC 61966-6-2005 Multimedia systems and equipment - Colour measurement and management - Part 6: Front projection displays . Multimedia systems and equipment - Colour measurement and management - Part 6: Front projection displays .

169IEC 60657-1979 Non-ionizing radiation hazards in the frequency range from 10 MHz to 300 000 MHz . Non-ionizing radiation hazards in the frequency range from 10 MHz to 300 000 MHz .

170IEC 62221-2001 Optical fibres - Measurement methods - Microbending sensitivity . Optical fibres - Measurement methods - Microbending sensitivity .

171IEC 62319-1-2005 Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification . Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1: Generic specification .

172IEC 62319-1-1-2005 Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application . Polymeric thermistors - Directly heated positive step function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application .

173IEC 60076-SER-2004 Power transformers - ALL PARTS . Power transformers - ALL PARTS .

174IEC 60086-3-2004 Primary batteries - Part 3: Watch batteries . Primary batteries - Part 3: Watch batteries .

175IEC 61169-8-2007 RADIO-FREQUENCY CONNECTORS - PART 8: SECTIONAL SPECIFICATION - RF COAXIAL CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 6,5 MM (0,256 IN) WITH BAYONET LOCK - CHARACTERISTIC IMPEDANCE 50 OHMS (TYPE

中文版正文页数：10中文版正文字数：6680译文报价：1068.00译文优惠价：935.00

176IEC 60748-23-1-2002 Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification . Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification .

177IEC 60748-23-3-2002 Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers self-audit checklist and report . Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers self-audit checklist and report .

178IEC 60748-23-4-2002 Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification . Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification .

179IEC 60749-30-2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing . Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing .

180IEC 60989-1991 Separating transformers, autotransformers, variable transformers and reactors. . Separating transformers, autotransformers, variable transformers and reactors. .

181IEC 62310-1-2005 Static transfer systems (STS) - Part 1: General and safety requirements . Static transfer systems (STS) - Part 1: General and safety requirements .

182IEC 61019-1-2004 Surface acoustic wave (SAW) resonators - Part 1: Generic specification . Surface acoustic wave (SAW) resonators - Part 1: Generic specification .

183IEC 61333-1996 U和E铁氧体磁心的标记 Marking on U and E ferrite cores

184IEC 61051-2-1991 Varistors for use in electronic equipment - Part 2: Sectional specification for surge suppression varistors Varistors for use in electronic equipment - Part 2: Sectional specification for surge suppression varistors

185IEC 60927-1996 VERSION OFICIAL EN ESPANOL - Aparatos auxiliares para lámparas. Aparatos arrancadores (excepto cebadores de efluvios). Prescripciones de funcionamiento. . VERSION OFICIAL EN ESPANOL - Aparatos auxiliares para lámparas. Aparatos arrancadores (excepto cebadores de efluvios). Prescripciones de funcionamiento. .

186IEC 61077-1991 VHS型12.65mm(0.5in)磁带的螺旋扫描录象磁带盒系统 Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS; compact VHS video cassette

187VHS型12dianhao65mm(0dianhao5in)磁带螺旋扫描盒式磁带录像系统 > IEC 60774-3-1993 VHS型12.65mm(0.5in)磁带螺旋扫描盒式磁带录像系统.第3部分:S-VHS Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS; part 3: S-VHS

188IEC 61400-SER-2005 Wind turbine generator systems - ALL PARTS . Wind turbine generator systems - ALL PARTS .

189X射线成像诊断设备 > IEC 60627-2001 X射线成像诊断设备.通用和乳腺X线照射反散射栅的特性 Diagnostic X-ray imaging equipment - Characteristics of general purpose and mammographic anti-scatter grids

190IEC 60522-2003 X射线管装置的永久滤波的测定 Determination of the permanent filtration of X-ray tube assemblies .

191X射线医疗诊断保护装置 > IEC 61331-3-1998 X射线医疗诊断保护装置.第3部分:性腺防护装置和防护服装 Protective devices against diagnostic medical X-radiation - Part 3: Protective clothing and protective devices for gonads

192YME总线 > 1字节至4字节数据的微处理系统 > IEC 60821 AMD 1-1999 YME总线.1字节至4字节数据的微处理系统.补充件1 VMEbus - Microprocessor system bus for 1 byte to 4 byte data; Amendment 1

193IEC 61098-2003 γ和β射线放射源个人用表面污染监测机组 Radiation protection instrumentation - Installed personnel surface contamination monitoring assemblies .

194爱迪森螺纹灯座 > IEC 60238 AMD 1-1999 爱迪森螺纹灯座.修改件1 Edison screw lampholders; Amendment 1

195爱迪森螺纹灯座 > IEC 60238 AMD 2-2002 爱迪森螺纹灯座.修改件2 Edison screw lampholders; Amendment 2

196安装在铁路车辆上的电力变换器 > IEC 61287-1-1995 安装在铁路车辆上的电力变换器.第1部分:特性和试验方法 Power convertors installed on board rolling stock - Part 1: Characteristics and test methods

197按B型格式用12dianhao65mm(0dianhao5in)磁带螺旋扫描录相机磁带盒系统 > 调频录音 > IEC 61053-1-1991 按B型格式用12.65mm(0.5in)磁带螺旋扫描录相机磁带盒系统.调频录音.第1部分:525行-50字段体系 Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type beta format; FM audio recording; part 1: 625 line-50 field systems

198按B型格式用12dianhao65mm(0dianhao5in)磁带螺旋扫描录相机磁带盒系统 > 调频录音 > IEC 61053-2-1991 按B型格式用12.65mm(0.5in)磁带螺旋扫描录相机磁带盒系统.调频录音.第2部分:525行-60字段体系 Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type beta format; FM audio recording; part 2: 525 line-60 field systems

199白炽灯 > 安全规范 > IEC 60432-1-1999 白炽灯.安全规范.第1部分:家用和类似一般照明用钨丝灯 Incandescent lamps - Safety specifications - Part 1: Tungsten filament lamps for domestic and similar general lighting purposes

200白炽灯 > 安全规范 > IEC 60432-2-1999 白炽灯.安全规范.第2部分:家用和类似一般照明用石英碘灯 Incandescent lamps - Safety specifications - Part 2: Tungsten halogen lamps for domestic and similar general lighting purposes

201IEC 60630-1994 白炽灯的最大灯泡外形图 Maximum lamp outlines for incandescent lamps

202白炽灯的最大灯泡外形图 > IEC 60630 AMD 3-1999 白炽灯的最大灯泡外形图.补充件3 Maximum lamp outlines for incandescent lamps; Amendment 3

203白炽灯的最大灯泡外形图 > IEC 60630 AMD 2-1998 白炽灯的最大灯泡外形图.第2次修订 Maximum lamp outlines for incandescent lamps; Amendment 2

204白炽灯的最大外形尺寸 > IEC 60630 AMD 4-2002 白炽灯的最大外形尺寸.修改件4 Maximum lamp outlines for incandescent lamps; Amendment 4

205白炽灯用直流或交流电子降压转换器 > IEC 61047 Edition 1.2-2001 白炽灯用直流或交流电子降压转换器.性能要求 D.C. or A.C. supplied electronic step-down convertors for filament lamps - Performance requirements

206白炽灯用最大电灯外形图 > IEC 60630 AMD 1-1997 白炽灯用最大电灯外形图.修改件1 Maximum lamp outlines for incandescent lamps; Amendment 1

207白热丝灯直流或交流供电电子降压换流器 > IEC 61047-2004 白热丝灯直流或交流供电电子降压换流器.性能要求 DC or AC supplied electronic step-down convertors for filament lamps - Performance requirements .

208IEC 60759-1983 半导体x射线能谱仪的标准试验程序 Standard test procedures for semiconductor X-ray energy spectrometers

209半导体X射线能谱仪的标准试验程序 > IEC 60759 AMD 1-1991 半导体X射线能谱仪的标准试验程序.第1次修改 Standard test procedures for semiconductor X-ray energy spectrometers; amendment 1

210半导体变流器 > 第1部分:电网换相变流器和一般要求 > IEC 60146-1-2-1991 半导体变流器.第1部分:电网换相变流器和一般要求.第2节:应用导则 Semiconductor convertors; general requirements and line commutated convertors; part 1-2: application guide

中文版正文页数：187译文报价：21602.00译文优惠价：18901.00

211半导体变流器 > 第1部分:电网换相变流器和一般要求 > IEC 60146-1-3-1991 半导体变流器.第1部分:电网换相变流器和一般要求.第3节:变压器和电抗器 Semiconductor convertors; general requirements and line commutated convertors; part 1-3: transformers and reactors

中文版正文页数：25译文报价：2608.00译文优惠价：2282.00

212半导体变流器 > IEC 60146-2-1999 半导体变流器.第2部分:包括直流变流器的自换向半导体变流器 Semiconductor converters - Part 2: Self-commutated semiconductor converters including direct d.c. converters

中文版正文页数：91译文报价：10308.00译文优惠价：9019.00

213半导体变流器 > 电网换相变流器和一般要求 > IEC 60146-1-1-1991 半导体变流器.电网换相变流器和一般要求.第1部分第1节:基本要求规范 Semiconductor convertors; general requirements and line commutated convertors; part 1-1: specifications of basic requirements

中文版正文页数：135译文报价：15984.00译文优惠价：13986.00

214半导体变流器 > 电网换相变流器和一般要求 > 第1部分第1节:基本要求规范 > IEC 60146-1-1 AMD 1-1996 半导体变流器.电网换相变流器和一般要求.第1部分第1节:基本要求规范.补充件1 Semiconductor convertors - General requirements and line commutated convertors - Part 1-1: Specifications of basic requirements; Amendment 1

中文版正文页数：3译文报价：349.00译文优惠价：305.00

215半导体电力变流器 > 可调速电气传动系统 > 一般要求 > IEC 61136-1-1992 半导体电力变流器.可调速电气传动系统.一般要求.第1部分:特别是对直流电动机传动的定额规范 Semiconductor power convertors; adjustable speed electric drive systems; general requirements; part 1: rating specifications, particularly for d.c. motor drives

216半导体分立器件 > IEC 60747-15-2003 半导体分立器件.第15部分:孤立的电力半导体器件 Discrete semiconductor devices - Part 15: Isolated power semiconductor devices

217半导体分立器件 > IEC 60747-8-4-2004 半导体分立器件.第8-4部分:电力开关装置用金属氧化物半导体场效应晶体管 MOSFETs)(Discrete semiconductor devices - Part 8-4: Metal-oxide-semiconductor field-effect transistors (MOSFETs) for power switching applications .

218IEC 60747-5-1-1997 半导体分立器件和集成电路 第5-1部分:光电子器件 总规范 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General

219半导体分立器件和集成电路 > 第5-1部分:光电器件 > 总则 > IEC 60747-5-1 AMD 1-2001 半导体分立器件和集成电路.第5-1部分:光电器件.总则.修改件1 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices; General; Amendment 1

220半导体分立器件和集成电路 > 第5-1部分:光电子器件 > IEC 60747-5-1 Edition 1.2-2002 半导体分立器件和集成电路.第5-1部分:光电子器件.总规范 Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General .

221半导体分立器件和集成电路 > 第5-2部分:光电子器件 > IEC 60747-5-2 AMD 1-2002 半导体分立器件和集成电路.第5-2部分:光电子器件.基础额定值及特性 Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices; Essential ratings and characteristics; Amendment 2

222半导体分立器件和集成电路 > 第5-3部分:光电子器件 > IEC 60747-5-3-1997 半导体分立器件和集成电路.第5-3部分:光电子器件.测试方法 Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods

223半导体器件 > 第10部分:分立器件和集成电路的总规范 > IEC 60747-10 AMD 2-1996 半导体器件.第10部分:分立器件和集成电路的总规范.补充件2 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits; Amendment 2

224半导体器件 > 第10部分:分立器件和集成电路的总规范 > IEC 60747-10 AMD 1-1995 半导体器件.第10部分:分立器件和集成电路的总规范.第1次修改 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits; Amendment 1

225半导体器件 > 第10部分:分立器件和集成电路的总规范 > IEC 60747-10 AMD 3-1996 半导体器件.第10部分:分立器件和集成电路的总规范.修改件3 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits; Amendment 3

226半导体器件 > 第11部分:分立器件分规范 > IEC 60747-11 AMD 1-1991 半导体器件.第11部分:分立器件分规范.第1次修改 Semiconductor devices; part 11: sectional specification for discrete devices; amendment 1

227半导体器件 > 第11部分:分立器件分规范 > IEC 60747-11 AMD 2-1996 半导体器件.第11部分:分立器件分规范.第2次修改 Semiconductor devices - Part 11: Sectional specification for discrete devices; Amendment 2

228半导体器件 > 第12-3部分:光电子器件 > 发光二极管的空白详细规范 > IEC 60747-12-3-1998 半导体器件.第12-3部分:光电子器件.发光二极管的空白详细规范.显示应用 Semiconductor devices - Part 12-3: Optoelectronic devices - Blank detail specification for light-emitting diodes - Display application

229半导体器件 > 第12-4部分:光电子器件 > IEC 60747-12-4-1997 半导体器件.第12-4部分:光电子器件.光纤维系统或分系统用带/不带引线的场效应管管脚组件额空白详细规格 Semiconductor devices - Part 12-4: Optoelectronic devices - Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems

230半导体器件 > 第12-5部分:光电子器件 > IEC 60747-12-5-1997 半导体器件.第12-5部分:光电子器件.光纤系统或子系统用有/无引线的针形光电管空白详细规范 Semiconductor devices - Part 12-5: Optoelectronic devices - Blank detail specification of pin-photodiodes with/without pigtail, for fibre optic systems or subsystems

231半导体器件 > 第12-6部分:光电子器件 > IEC 60747-12-6-1997 半导体器件.第12-6部分:光电子器件.光纤系统或子系统用有/无引线的雪崩光电管空白详细规范 Semiconductor devices - Part 12-6: Optoelectronic devices - Blank detail specification for avalanche photodiodes with/without pigtail, for fibre optic systems or subsystems

232半导体器件 > IEC 60747-12-1991 半导体器件.第12部分:光电器件的分规范 Semiconductor devices; part 12: sectional specification for optoelectronic devices

233半导体器件 > 第12部分:光电子器件 > IEC 60747-12-1-1995 半导体器件.第12部分:光电子器件.第2节:光缆系统和子系统用的带有引线的激光二极管模数的空白详细规范 Semiconductor devices - Part 12: Optoelectronic devices - Section 1: Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fibre optic systems or sub-systems

234半导体器件 > 第14-1部分:半导体传感器 > IEC 60747-14-1-2000 半导体器件.第14-1部分:半导体传感器.总则和分类 Semiconductor devices - Part 14-1: Semiconductor sensors; General and classification

235半导体器件 > 第14-2部分:半导体感应器 > IEC 60747-14-2-2000 半导体器件.第14-2部分:半导体感应器.霍尔元件 Semiconductor devices - Part 14-2: Semiconductor sensors; Hall elements

236半导体器件 > 第14-3部分:半导体传感器 > IEC 60747-14-3-2001 半导体器件.第14-3部分:半导体传感器.压力传感器 Semiconductor devices - Part 14-3: Semiconductor sensors; Pressure sensors

237半导体器件 > IEC 60747-16-10-2004 半导体器件.第16-10部分:单片型微波集成电路的技术验收程序(TAS) (Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits .

238半导体器件 > 第16-2部分:微波集成电路 > IEC 60747-16-2-2001 半导体器件.第16-2部分:微波集成电路.频率预定标器 Semiconductor devices - Part 16-2: Microwave integrated circuits; Frequency prescalers

239半导体器件 > 第16-3部分:微波集成电路 > IEC 60747-16-3-2002 半导体器件.第16-3部分:微波集成电路.频率变压器 Semiconductor devices - Part 16-3: Microwave integrated circuits; Frequency converters

240半导体器件 > 第16-4部分:微波集成电路 > IEC 60747-16-4-2004 半导体器件.第16-4部分:微波集成电路.开关 Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches .

241半导体器件 > 第9部分:绝缘双极晶体管(IGBTS) > IEC 60747-9 AMD 1-2001 半导体器件.第9部分:绝缘双极晶体管(IGBTS).修改件1 半导体器件.第9部分:绝缘双极晶体管(IGBTS).修改件1

242半导体器件 > 分立器件 > IEC 60747-11-1985 半导体器件.分立器件.第11部分:分立器件分规范 Semiconductor devices. Discrete devices. Part 11 : Sectional Specification for discrete devices

243半导体器件 > 分立器件 > IEC 60747-1-1983 半导体器件.分立器件.第1部分:总则 Semiconductor devices. Discrete devices. Part 1 : General

244半导体器件 > 分立器件 > 第2部分:整流二极管 > IEC 60747-2-2-1993 半导体器件.分立器件.第2部分:整流二极管.第1节:电流在100A以上具有规定环境和外壳的整流二极管(包括雪崩式整流二极管)的空白详细规范 Semiconductor devices; discrete devices; part 2: rectifier diodes; section 2: blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100 A

245半导体器件 > 分立器件 > 第2部分:整流二极管 > IEC 60747-2-1-1989 半导体器件.分立器件.第2部分:整流二极管.第1节:电流在100A以下具有规定环境和外壳的整流二极管(包括雪崩式整流二极管)的空白详细规范 Semiconductor devices; discrete devices; part 2: rectifier diodes; section one: blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, up to 100 A

246半导体器件 > 分立器件 > 第3部分:信号二极管(包括开关二极管)和调节二极管 > IEC 60747-3-1-1986 半导体器件.分立器件.第3部分:信号二极管(包括开关二极管)和调节二极管.第1节:信号二极管,开关二极管和受控雪崩二极管空白详细规范 Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes. Section One: Blank detail specification for signal diodes, switching diodes and controlled-avalanche diodes

247半导体器件 > 分立器件 > 第3部分:信号二极管(包括开关二极管)和调节二极管 > IEC 60747-3-2-1986 半导体器件.分立器件.第3部分:信号二极管(包括开关二极管)和调节二极管.第2节:稳压二极管和基准电压二极管(不包括温度补偿精密基准二极管)的空白详细规范 Semiconductor devices. Discrete devices. Part 3 : Signal (including switching) and regulator diodes. Section Two: Blank detail specification for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision reference

248半导体器件 > 分立器件 > 第3部分:信号二极管(包括开关二极管和稳压二极管) > IEC 60747-3 AMD 2-1993 半导体器件.分立器件.第3部分:信号二极管(包括开关二极管和稳压二极管).第2次修改件 Semiconductor devices; discrete devices; part 3: signal (including switching) and regulator diodes; amendment 2

249半导体器件 > 分立器件 > 第4-1部分:微波二极管和晶体管 > 微波领域有效晶体管 > IEC 60747-4-1-2000 半导体器件.分立器件.第4-1部分:微波二极管和晶体管.微波领域有效晶体管.空白详细规范 Semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors; Microwave field effect transistors; Blank detail specification

250半导体器件 > 分立器件 > IEC 60747-4-1991 半导体器件.分立器件.第4部分:微波二极管和晶体管 Semiconductor devices; discrete devices; part 4: microwave diodes and transistors

251半导体器件 > 分立器件 > IEC 60747-4 Edition 1.2-2001 半导体器件.分立器件.第4部分:微波器件 Semiconductor devices - Discrete devices - Part 4: Microwave devices

252半导体器件 > 分立器件 > 第6部分:晶体闸流管 > IEC 60747-6-2-1991 半导体器件.分立器件.第6部分:晶体闸流管.第2节:双向三极晶体闸流(三极双向可控硅开关元件),电流最多为100A空白详细规范 Semiconductor devices; discrete devices; part 6: thyristors; section 2: blank detail specification for bidirectional triode thyristors (triacs), ambient or case, up to 100 A

253半导体器件 > 分立器件 > 第6部分:晶体闸流管 > IEC 60747-6-3-1993 半导体器件.分立器件.第6部分:晶体闸流管.第3节:电流在100A以下的额定环境和外壳的反向阻挡三极闸流晶体管的空白详细规范 Semiconductor devices; discrete devices; part 6: thyristors: section 3: blank detail specification for reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A

254半导体器件 > 分立器件 > 第6部分:晶闸管 > IEC 60747-6-1-1989 半导体器件.分立器件.第6部分:晶闸管.第1节:电流在100A以下的额定环境和外壳的反向阻断三极闸流晶体管的空白详细规范 Semiconductor devices; discrete devices; part 6: thyristors; section one: blank detail specification for reverse blocking triode thyristors, ambient and case-rated, up to 100 A

255半导体器件 > 分立器件 > 第7部分:双极晶体管 > IEC 60747-7-3-1991 半导体器件.分立器件.第7部分:双极晶体管.第3节:开关设备用双极晶体管的空白详细规范 Semiconductor devices; discrete devices; part 7: bipolar transistors; section 3: blank detail specification for bipolar transistors for switching appliances

256半导体器件 > 分立器件 > 第7部分:双极晶体管 > IEC 60747-7-4-1991 半导体器件.分立器件.第7部分:双极晶体管.第4节:高频放大双极晶体管的空白详细规范 Semiconductor devices; discrete devices; part 7: bipolar transistors; section 4: blank detail specification for case-rated bipolar transistors for high-frequency amplification

257半导体器件 > 分立器件 > 第7部分:双极性晶体管 > IEC 60747-7-1-1989 半导体器件.分立器件.第7部分:双极性晶体管.第1节:低频和高频放大用的额定环境晶体管的空白详细规范 Semiconductor devices; discrete devices; part 7: bipolar transistors; section one: blank detail specification for ambient-rated bipolar transistors for low and high-frequency amplification

258半导体器件 > 分立器件 > 第7部分:双极性晶体管 > IEC 60747-7-2-1989 半导体器件.分立器件.第7部分:双极性晶体管.第2节:低频放大用的额定环境双极性晶体管的空白详细规范 Semiconductor devices; discrete devices; part 7: bipolar transistors; section two: blank detail specification for case-rated bipolar transistors for low-frequency amplification

259半导体器件 > 分立器件 > 第8部分:场效应晶体管 > IEC 60747-8-1-1987 半导体器件.分立器件.第8部分:场效应晶体管.第1节:1GHz 5W以下的单栅极场效应晶体管的空白详细规范 Semiconductor devices - Discret devices. Part 8: Field-effect transistors. Blank detail specification for single-gate field-effect transistors, up to 5 W and 1 GHz.

260半导体器件 > 分立器件 > 第8部分:场效应晶体管 > IEC 60747-8-2-1993 半导体器件.分立器件.第8部分:场效应晶体管.第2节:外壳限定的功率放大器用场效应晶体管空白详细规范 Semicoductor devices; discrete devices; part 8: field-effect transistors; section 2: blank detail specification for field-effect transistors for case-rated power amplifier applications

261半导体器件 > 分立器件 > IEC 60747-9 Edition 1.1-2001 半导体器件.分立器件.第9部分:绝缘双极晶体管 IGBTS

262半导体器件 > 分立器件和集成电路 > 第1部分:总则 > IEC 60747-1 AMD 3-1996 半导体器件.分立器件和集成电路.第1部分:总则.第3次修改 Semiconductor devices - Discrete devices and integrated circuits - Part 1: General; Amendment 3

263半导体器件 > 分立器件和集成电路 > 第4-2部分:微波二极管和晶体管 > 集成线路微波放大器 > IEC 60747-4-2-2000 半导体器件.分立器件和集成电路.第4-2部分:微波二极管和晶体管.集成线路微波放大器.空白详细规范 Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification

264半导体器件 > 分立器件和集成电路 > 第8部分:场效应晶体管 > IEC 60747-8-3-1995 半导体器件.分立器件和集成电路.第8部分:场效应晶体管.第3节:开关电路用场效应晶体管空白详细规范 Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Section 3: Blank detail specification for case-rated field-effect transistors for switching applications

265半导体器件 > IEC 60749-1996 半导体器件.机械和气候试验方法 Semiconductor devices - Mechanical and climatic test methods

266半导体器件 > 机械和气候试验方法 > IEC 60749-10 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第10部分:机械冲击 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

267半导体器件 > 机械和气候试验方法 > 第11部分:温度的急速变化 > IEC 60749-11 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第11部分:温度的急速变化.双液电镀槽法 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method

268半导体器件 > 机械和气候试验方法 > IEC 60749-12 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第12部分:振动,可变频率 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

269半导体器件 > 机械和气候试验方法 > IEC 60749-13 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第13部分:盐性环境 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

270半导体器件 > 机械和气候试验方法 > IEC 60749-14-2003 半导体器件.机械和气候试验方法.第14部分:终端装置的坚固性(引线牢固性) Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity

271半导体器件 > 机械和气候试验方法 > IEC 60749-16-2003 半导体器件.机械和气候试验方法.第16部分:粒子冲击噪声探测 PIND

272半导体器件 > 机械和气候试验方法 > IEC 60749-20-2002 半导体器件.机械和气候试验方法.第20部分:SMDs塑料囊状物抗湿气和焊接热的综合影响 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

273半导体器件 > 机械和气候试验方法 > IEC 60749-20 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第20部分:塑料封装的SMDs抗湿气和焊接热的综合影响 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

274半导体器件 > 机械和气候试验方法 > IEC 60749-21-2004 半导体器件.机械和气候试验方法.第21部分:可焊性 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

275半导体器件 > 机械和气候试验方法 > 第26部分:静电放电敏感性试验 > IEC 60749-26-2003 半导体器件.机械和气候试验方法.第26部分:静电放电敏感性试验.人体模型 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing; Human body model (HBM

276半导体器件 > 机械和气候试验方法 > 第27部分:静电放电灵敏度测试 > IEC 60749-27-2003 半导体器件.机械和气候试验方法.第27部分:静电放电灵敏度测试.机器模型 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing; Machine model (MM

277半导体器件 > 机械和气候试验方法 > IEC 60749-31-2002 半导体器件.机械和气候试验方法.第31部分:塑料密封器件的易燃性(内部感应) Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced

278半导体器件 > 机械和气候试验方法 > IEC 60749-32-2002 半导体器件.机械和气候试验方法.第32部分:塑料密封器件的易燃性(外部感应) Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced

279半导体器件 > 机械和气候试验方法 > IEC 60749-32 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第32部分:塑料密封器件的易燃性(外部引起的) Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced

280半导体器件 > 机械和气候试验方法 > 第33部分:加速抗湿 > IEC 60749-33-2004 半导体器件.机械和气候试验方法.第33部分:加速抗湿.无偏压热器 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

281半导体器件 > 机械和气候试验方法 > IEC 60749-7 Corrigendum 1-2003 半导体器件.机械和气候试验方法.第7部分:其他残余气体的分析和内部含水量的测量 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

282半导体器件 > 机械和气候试验方法 > IEC 60749 AMD 1-2000 半导体器件.机械和气候试验方法.修改件1 Semiconductor devices - Mechanical and climatic test methods; Amendment 1

283半导体器件 > 机械和气候试验方法 > IEC 60749 AMD 2-2001 半导体器件.机械和气候试验方法.修改件2 Semiconductor devices - Mechanical and climatic test methods; Amendment 2

284半导体器件 > 集成电路 > 第11部分:半导体集成电路(混合电路除外)的分规范 > IEC 60748-11 AMD 1-1995 半导体器件.集成电路.第11部分:半导体集成电路(混合电路除外)的分规范.第1次修改 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 1

285半导体器件 > 集成电路 > 第11部分:不包括混合电路的半导体集成线路分规范 > IEC 60748-11 AMD 2-1999 半导体器件.集成电路.第11部分:不包括混合电路的半导体集成线路分规范.补充件2 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 2

286半导体器件 > 集成电路 > IEC 60748-11-1-1992 半导体器件.集成电路.第11部分第1节:半导体集成电路(混合电路除外)内部目视检查 Semiconductor devices; integrated circuits; part 11; section 1: internal visual examination for semiconductor integrated circuits excluding hybrid circuits

287半导体器件 > 集成电路 > IEC 60748-1-2002 半导体器件.集成电路.第1部分:总则 Semiconductor devices - Integrated circuits - Part 1: General

288半导体器件 > 集成电路 > IEC 60748-20-1988 半导体器件.集成电路.第20部分:薄膜集成电路及混合薄膜集成电路的总规范 Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits

289半导体器件 > 集成电路 > 第20部分:薄膜集成电路及混合薄膜集成电路的总规范 > IEC 60748-20 AMD 1-1995 半导体器件.集成电路.第20部分:薄膜集成电路及混合薄膜集成电路的总规范.第1次修改 Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits; Amendment 1

290半导体器件 > 集成电路 > 第20部分:薄膜集成电路及混合薄膜集成电路的总规范 > IEC 60748-20-1-1994 半导体器件.集成电路.第20部分:薄膜集成电路及混合薄膜集成电路的总规范.第1节:内部表观检验要求 Semiconductor devices; integrated circuits; part 20: generic specification for film integrated circuits and hybrid film integrated circuits; section 1: requirements for internal visual examination

291半导体器件 > 集成电路 > 第2-11部分:数字集成线路 > 单供应集成电路空白详细规范 > IEC 60748-2-11-1999 半导体器件.集成电路.第2-11部分:数字集成线路.单供应集成电路空白详细规范.电可擦的,只读程序化存储器 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

292半导体器件 > 集成电路 > IEC 60748-21-1997 半导体器件.集成电路.第21部分:基于质量保证程序的薄膜集成电路和混合薄膜集成电路分规范 Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure

293半导体器件 > 集成电路 > IEC 60748-21-1-1997 半导体器件.集成电路.第21部分第1节:基于质量保证程序的薄膜集成电路和混合薄膜集成电路空白详细规范 Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

294半导体器件 > 集成电路 > 第2-20部分:数字集成电路 > IEC 60748-2-20-2000 半导体器件.集成电路.第2-20部分:数字集成电路.系列规范:低压集成电路 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits

295半导体器件 > 集成电路 > IEC 60748-22-1997 半导体器件.集成电路.第22部分:基于能力鉴定程序的薄膜集成电路和混合薄膜集成电路分规范 Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

296半导体器件 > 集成电路 > IEC 60748-22-1-1997 半导体器件.集成电路.第22部分第1节:基于能力鉴定程序的薄膜集成电路和混合薄膜集成电路空白详细规范 Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

297半导体器件 > 集成电路 > 第23-2部分:混合集成电路和薄膜结构 > 生产线认证 > IEC 60748-23-2-2002 半导体器件.集成电路.第23-2部分:混合集成电路和薄膜结构.生产线认证.内部审查和特殊试验 Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures; Manufacturing line certification; Internal visual inspection and special tests

298半导体器件 > 集成电路 > 第23-5部分:混合集成电路和薄膜结构 > 生产线认证 > IEC 60748-23-5-2003 半导体器件.集成电路.第23-5部分:混合集成电路和薄膜结构.生产线认证.鉴定批准 Semiconductor devices - Integrated circuits - Part 23-5: Hybrid integrated circuits and film structures; Manufacturing line certification; Procedure for qualification approval

299半导体器件 > 集成电路 > 第2部分:数字集成电路 > IEC 60748-2-10-1994 半导体器件.集成电路.第2部分:数字集成电路.第10节:集成电路动态读/写存储器空白详细规范 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 10: Blank detail specification for integrated circuit dynamic read/write memories

300半导体器件 > 集成电路 > 第2部分:数字集成电路 > IEC 60748-2-1-1991 半导体器件.集成电路.第2部分:数字集成电路.第1节:双极整体数字集成电路门(自由逻辑数组除外) Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 1: blank detail specification for bipolar monolithic digital integrated circuits gates (excluding uncommitted logic arrays

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标准代号：
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国际标准化组织(ISO)
国际电工委员会(IEC)
欧洲标准(EN)
美国国家标准学会(ANSI)
英国国家标准学会(BS)
德国标准化学会(DIN)
日本工业标准(JIS)
法国标准化协会(NF)
美国机械工程师协会(ASME)
美国材料与实验协会(ASTM)
美国电气电子工程师学会(IEEE)
美国保险商实验所(UL)
美国石油学会(API)
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中华人民共和国国家标准和行业标准代号

一、中华人民共和国国家标准代号

GB 强制性国家标准代号

GB/T 推荐性国家标准代号

二、中华人民共和国行业标准代号
农业 NY   水产 SC  水利 SL   林业 LY  轻工 QB   纺织 FZ  医药 YY  民政 MZ  教育 JY  烟草 YC  黑色冶金 YB  有色冶金 YS  石油天然气 SY  化工 HG   石油化工 SH  建材 jc  地质矿产 DZ  土地管理 TD  测绘 CH  机械 JB  汽车 QC  民用航空 MH  兵工民品 WJ  船舶 CB  航空 HB  航天 QJ  核工业 EJ  铁路运输 TB   交通 JT   劳动和劳动安全 LD  电子 SJ  通信 YD  广播电影电视 GY  电力 DL  金融 JR  海洋 HY  档案 DA  商检 SN  文化 WH  体育 TY  商业 SB  物资管理 WB  环境保护 HJ  稀土 XB  城镇建设 CJ  建筑工业 JG  新闻出版 CY  煤炭 MT  卫生 WS  公共安全 GA  包装 BB  地震 DB  旅游 LB  气象 QX  外经贸 WM  海关 HS  邮政 YZ  推荐性行业标准的代号是在强制性行业标准代号后面加／T，例如农业行业的推荐性行业标准代号是NY／T


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